Certifications
Standard:
ISO9001
Number:
CNQMS047967
Issue Date:
2021-06-21
Expiry Date:
2024-06-21
Scope/Range:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By:
NSFInternational Strategic Registrations
Standard:
IATF 16949:2016
Number:
0406197
Issue Date:
2021-06-21
Expiry Date:
2024-06-21
Scope/Range:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By:
NSFInternational Strategic Registrations
Standard:
GB/T24001-2016/IS014001:2015
Number:
2052022E00126R2M
Issue Date:
2022-07-25
Expiry Date:
2026-07-24
Scope/Range:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By:
IAF and CNAS
Standard:
Integration of Informatizafion and Industrialization Management System Certificate
Number:
AIITRE-00123IIIMS0470801
Issue Date:
2023-05-26
Expiry Date:
2026-05-25
Scope/Range:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By:
CEPREI
Standard:
GJB 9001C-2017
Number:
02623J31381R0M
Issue Date:
2023-06-27
Expiry Date:
2026-06-26
Scope/Range:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By:
BTCC-GJB
Company Profile
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Contact Person: MsJiang
