Ultra Fine wire Good loop stability 0.01 mm Copper Bonding Wire for Communications
Characteristics |
* High conductivity * High tensile strength with high elongation * Good loop stability * Significantly reduced formation of intermetallic phases * Very good ball formation under protective gas |
Description of Copper Bonding Wire
The Copper bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Copper bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity. Winner can provide Copper bonding wire with different wire diameters from 15um-50um according to customer requirements.
Applications include:
* Computer : PC, Tablets, Servers & systems, Consumer
* Electronics : Smartphones & phones, TVs, Imaging devices, Wearable electronics
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
Dia | EL(%) | BL(gf) |
mil | um | 4N | 5N | 4N | 5N |
WCBW-1 | WCBW-2 | WCBW-3 | WCBW-4 | WCBW-5 | WCBW-6 | WCBW-7 | WCBW-8 |
0.6 | 15 | 3-15 | 3-15 | 3-16 | 3-17 | >3.0 | >3.0 | >3.0 | >3.0 |
0.7 | 18 | 3-17 | 3-17 | 3-18 | 4-19 | >3.0 | >3.0 | >3.5 | >4.0 |
0.8 | 20 | 4-18 | 4-18 | 4-19 | 5-20 | >4.0 | >4.5 | >5.0 | >5.0 |
0.9 | 23 | 6-20 | 6-20 | 6-21 | 6-22 | >5.0 | >6.0 | >6.0 | >6.5 |
1.0 | 25 | 8-22 | 8-23 | 8-24 | 8-24 | >6.0 | >7.0 | >7.0 | >8.0 |
1.2 | 30 | 9-23 | 9-24 | 9-25 | 9-26 | >8.0 | >8.5 | >8.0 | >10.0 |
1.3 | 33 | 9-24 | 10-25 | 10-26 | 10-27 | >10.0 | >11.0 | >10.0 | >12.0 |
1.5 | 38 | 10-25 | 10-26 | 10-27 | 11-28 | >12.0 | >12.0 | >12.0 | >14.0 |
1.7 | 43 | 10-26 | 11-28 | 10-30 | 11-30 | >15.0 | >16.0 | >15.0 | >18.0 |
2.0 | 50 | 12-28 | 12-30 | 12-32 | 12-34 | >20.0 | >20.0 | >20.0 | >20.0 |
The Advantages of Copper Bonding Wire Cost Savings
The relatively low cost of copper is one of the reasons for its appeal as an alternative interconnect material. By replacing gold wires with copper material, thus replacing the precious metal part, significant cost savings are possible. In applications that require increased wire diameters, the usage of copper bears a disproportionately high impact on the saving effect. Superior Performance of Copper Wires Copper exhibits significantly better conductivity than gold or aluminum. Therefore better heat dissipation and increased power ratings are attainable with thinner wire diameters. Copper possesses higher mechanical properties compared to gold. Therefore it displays excellent ball neck strength and high loop stability during molding or encapsulation.

1.What kind of Enameled copper wire do Winner produce?
We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.
2.What's diameters available of the Enamelled copper wire ?
We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.
3.What's selfbonding enameled copper wire?
Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated
by heat or solvents.
Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.
The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications
as bobbins, tape, varnishing, or impregnation may be eliminated.
4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?
Of course you can!




