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This product is widely utilized in the packaging of ICLED. In this application, its unique combination of properties plays a vital role. It ensures the reliable operation of ICLED components by providing stable electrical connections and efficient heat management. Furthermore, it is also used in other diverse fields where similar requirements for material properties exist, such as in some high - tech manufacturing and electronics industries.
Silver alloy Bonding Wire AG99% | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
YF-99 | 18(0.7mil) | >4 | 3-20 | 500/1000 |
99B | 20(0.8mil) | >5 | 3-20 | 500/1000 |
SW-21 | 23(0.9mil) | >7 | 3-20 | 500/1000 |
99A | 25(1.0mil) | >8 | 3-20 | 500/1000 |
99A | 30(1.2mil) | >11 | 3-20 | 500/1000 |
Note: The above Diameter, BL and EL parameters can be customized according to customer requirements.
Application: